JPH0466774U - - Google Patents
Info
- Publication number
- JPH0466774U JPH0466774U JP11084390U JP11084390U JPH0466774U JP H0466774 U JPH0466774 U JP H0466774U JP 11084390 U JP11084390 U JP 11084390U JP 11084390 U JP11084390 U JP 11084390U JP H0466774 U JPH0466774 U JP H0466774U
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- crimp
- bent portion
- crimp sleeve
- conductive wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11084390U JPH0466774U (en]) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11084390U JPH0466774U (en]) | 1990-10-23 | 1990-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0466774U true JPH0466774U (en]) | 1992-06-12 |
Family
ID=31858240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11084390U Pending JPH0466774U (en]) | 1990-10-23 | 1990-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0466774U (en]) |
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1990
- 1990-10-23 JP JP11084390U patent/JPH0466774U/ja active Pending